Peel-and-Stick Sarcon XR-v Introduced
Fujipoly America Corp. announces the introduction of Sarcon® XR-v, a newly formulated silicone thermal interface material that offers the installation flexibility of a thin, putty-like sheet and the performance of a high-end gap filler pad. Sarcon® XR-v sets a new performance benchmark for the company by providing a thermal conductivity of 6.0 W/m°K and a very low thermal resistance of .04 °Cin2/W.
The non-flammable, peel-and-stick interface material is only .11mm thick and can quickly be applied to almost any electronic component or heat sink with the ease of an adhesive label. Sarcon® XR-v is available in sheet form on an easy-release carrier up to a maximum 50mm x 50mm dimension. Once applied, this thermal interface material exhibits an extremely low contact resistance and efficiently transfers heat from its source to a heat sink or spreader.
- Thermal conductivity: 6.0 W/m°K
- Extremely Low thermal resistance: .04 °Cin2/W
- Material thickness:
- Available in peel-and-stick sheets: max
